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Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
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US $3.80-10.89
/ Ton
|
1 Ton
(Min. Order)
CAS No.:
63428-84-2
Bonding Function:
Polyamide Hot Melt Adhesive
Morphology:
Solid-State
Application:
Automobile, Woodworking, Footwear & Leather, Fiber & Garment, Packing
Material:
Polyamide Resin
Classification:
Hot Melt
Samples:
US$ 0/kg
1 kg(Min.Order)
|
Request Sample
Customization:
Available
|
Customized Request
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