• Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
  • Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
  • Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
  • Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
  • Polyamide Hot Melt Adhesive as Seal Material in Electronic Components
  • Polyamide Hot Melt Adhesive as Seal Material in Electronic Components

Polyamide Hot Melt Adhesive as Seal Material in Electronic Components

CAS No.: 63428-84-2
Bonding Function: Polyamide Hot Melt Adhesive
Morphology: Solid-State
Application: Automobile, Woodworking, Footwear & Leather, Fiber & Garment, Packing
Material: Polyamide Resin
Classification: Hot Melt
Samples:
US$ 0/kg 1 kg(Min.Order)
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Customization:
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Rating: 5.0/5
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Basic Info.

Model NO.
HPMA 150-90(25)
Main Agent Composition
Inorganic Adhesive Material
Characteristic
Weatherability
Promoter Composition
Polyamide Hot Melt Adhesive
Composition
Inorganic Material
Color
Yellow
Product Name
Polyamide Hot Melt Adhesive as Seal Material in EL
Appearance
Yellow Granular
Acid Value
4-12
Amine Value
5 Max
Transport Package
25kgs Per Bag, or as Per as Client Require
Specification
polyamide resin
Trademark
OEM
Origin
Anhui, China
HS Code
35069110
Production Capacity
100 Tons Per Month

Product Description

Polyamide Hot Melt Adhesive as Seal Material in Electronic ComponentsWhy choose us:
1. China First manufacturer of polyamide hot melt adhesive
2. Free samples
3. Quality is our culture
4. Small orders are welcome
5. Customsize is available
6. With us, your money is in safe
Polyamide Hot Melt Adhesive as Seal Material in Electronic ComponentsPolyamide Hot Melt Adhesive as Seal Material in Electronic Components
Type for your choice
                           INDEX    
BATCHNO.*
Softening Point Viscosity Color Acid Value Amine Value Specific Gravity Flash Point
HMPA 150-90(25) 170-180 3500-5,600 cps 8 Maximum 0-2.0 0-12 0.97 271
HMPA 55-55 (e) 155 +/- 5°C 5500 +/- 2500 cps 8 Maximum 5 - 12 0.2 - 1.5 0.97 271
HMPA 8700C 100 - 110°C 10,000-20,000 cps 8 Maximum 10max 8max 0.97 271

Application: Suitable for the shoemaking industry!
It can be used for the connection of various materials of shoe sole, heel, vamp and various decorative accessories etc.

Other Applications
Polyamide Hot Melt Adhesive as Seal Material in Electronic Components


Our Factory

Packing & Shipping
Packaging: in double layer craft paper or woven compound bag
Details: 25kg/bag, 25kg/drum,1mt/bag, 15mt without pallet or 12mts/20'fcl with pallet
Delivery Detail: 15-25 days after receiving advanced T/T Payment

Our services
1. Samples send to you freely
2. Delivery on time, quality according to customer request completely
3. OEM, ODM is welcome
4. Support small wholesale, retails. Any inquires will be replied within 24 hour

Company information
I-Sourcing one of hot melt polyamide leading producer in China, established in 2007, specializing in development, production and selling of hot-melt polyamide adhesives. It has been widely used in automotives, air filters, book bonding, baby diapers, textile interlining, fabric lamination, textile heat transfer printing, clothing accessories and shoes.
After more than 7 years effort and development, I-Sourcing has established advanced production lines, advanced underwater pelletizing processing. The automatic control of equipments and the continuous line production ensure the high quality and stability of our products.

FAQ

What are hot melt adhesives?
Hot melt adhesives are solid adhesives at room temperature, contain absolutely no water and solvents, and are mainly composed of thermoplastic resin. Generally speaking, hot melt coaters, known as applicators, are used to melt hot melt adhesives. Guns are used to apply these adhesives in their liquid state to the adherend, which is then crimped, cooled, and adhered. The time required to complete the adhering process is only the time required to cool and solidify the adhesive, which makes it possible to adhere objects to each other in a few seconds to a few minutes.
 
What can you tell me about the open time and setting time?
Hot melt adhesives melt under high temperatures. You have to apply these adhesives to an object and adhere another object to it before these adhesives cool and lose their adhesive properties. The open time is the period of time from when the adhesive is applied to the adherend to when the adhesive cools to the point that it loses its adhesive properties. The open time is normally a length of time from a few seconds to a few minutes and is determined on the basis of the usage conditions, ambient environment, and hot melt adhesive mixture.  The setting time is the period of time until the hot melt adhesive applied to the adherend cools, solidifies, and exhibits its initial adhesive strength.
Polyamide Hot Melt Adhesive as Seal Material in Electronic Components

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