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  • Low Pressure Molding Hot Melt Polyamide Adhesive
  • Low Pressure Molding Hot Melt Polyamide Adhesive
  • Low Pressure Molding Hot Melt Polyamide Adhesive
CAS No.: 63428-84-2
EINECS: 426-580-9
Bonding Function: Thermoplastic
Morphology: Particle
Application: Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing
Material: Polyimide
Samples:
US$ 0/grams 1 grams(Min.Order)
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Customization:

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