Low Pressure Molding Hot Melt Polyamide Adhesive

• CAS No.: 63428-84-2
• EINECS: 426-580-9
• Bonding Function: Thermoplastic
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: LPM 1025B
• Morphology: Particle
• Application: Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing
• Material: Polyimide
• Classification: Hot Melt
• Main Agent Composition: Natural Polymer
• Characteristic: Weatherability
• Promoter Composition: Polymerization Inhibitor
• Composition: Organic Material
• Color: Black
• Production Name: Hot Melt Polyamide Adhesive Lpm 1025b
• Softening Point: 150-165 Degree
• Viscosity: 1800-3200 Cps
• Acid Value: 9.5 Mg KOH/G
• Amine Value: 1.0 Mg KOH/G
• Specific Gravity: 0.97 at 25 Degree
• Flash Point: 271 Degree, Coc, ASTM D 6450
• Shipping Classification: Non-Hazardous Hot Melt Adhesive
• Use: Low Pressure Molding, Electrical Components
• Features: Good Flexibility
• Transport Package: Bags
• Specification: 25KGS / BAG
• Trademark: iSuo Chem or OEM
• Origin: China
• HS Code: 350691
• Production Capacity: 2000 Tons/Year

Product Description

Specifications

Property	Detail or Method	Specification
Softening Point:	°C Ring and Ball ASTM E 28	150-165
Viscosity	cps/mPa·s at 190°C LVT Brookfield ASTM D 3236	1,800-3,200 cps
Color	40% in n-Butanol, Gardner	8 Maximum
		Typical Values
Acid Value	mg KOH/g	9.5
Amine Value	mg KOH/g	1.0
Specific Gravity	At 25°C	0.97
Flash Point	°C, COC, ASTM D 6450	271

Application

LPM has the application systems for hot melt adhesive.

 

Packaging

 

From of supply: Granulate, store in 25 kg net weight bag.
storage: Up to max. +35 °C, min. 12 months in original closed container. Be sure that used container are closed immediately with insulation against moisture. Maybe the adhesive and application properties can decrease by storing with open containers.


 

Handling suggestions

When substrates with high heat conductivity shall be bonded the use of a given application temperature is necessary for good wetting. The substrate surface should be free of dust and cleaned with a suitable solvent so that there is no fat and oil.

Do not heat the product over the mentioned application temperature range. Without using do not heat the product for a long time, because the quality can decrease or extremely the product cokes. The standby temperature is 80 °C.

LMP 1025B may adsorb moisture from the air. This will not be obvious in the solid form, but could cause foaming as the adhesive is melted which may result in poor bonds. Re close the container tightly as soon as sufficient adhesive has been removed for immediate use.

 

Other tips

Apparatus cleaning: Remove very strong coked and not thermoplastic rests of hot melt mechanically.

Safey precautions: No health hazards are expected when this product is in solid form. However, once melted it is like any hot liquid, which can produce severe burns. The appropriate safety precautions should be used (see also safety- data-sheet). If the molten adhesive has contacted your skin, cool the affected area immediately with cold water. Do not try to remove the adhesive from the skin. Go to your first aid station for attention.

Regulatios: On the base of the available data, the product is not a hazardous material according to the China chemical law or the hazardous substances regulations.