Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive

Product Details
Customization: Available
CAS No.: 63428-84-2
Formula: Polyamide
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  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
  • Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
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Basic Info.

Model NO.
Flex+ 8077
EINECS
Hot Melt Adehsive
Bonding Function
Instant Adhesive
Morphology
Granule
Application
Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing, Low Pressure Molding
Material
Polyimide
Classification
Hot Melt
Main Agent Composition
Thermoplastic Resin
Characteristic
Waterproof
Promoter Composition
Antioxidant
Composition
Organic Material
Color
Yellow
Low Temperature Resistance
-40°c
Adhesion
Metal, Plastic, Paper, Film, Fabric
Transport Package
Bags, Pallet, Container
Specification
20kgs/bag
Trademark
Spiderbond
Origin
China
HS Code
3506911000
Production Capacity
10000mt/ Year

Product Description


Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
Product
Softening Point
Melt Viscosity
Acid Value
Amine Value
Eco 2030
105-115°C
1,300-1,800 cps at 160°C
<12 mg KOH/g
<12 mg KOH/g
Flex 50-220
120-130°C
9,000-13,000 cps at 190°C
<3 mg KOH/g
<12 mg KOH/g
Flex+ 8077
135-145°C
3,000-4,700 cps at 190°C
<3 mg KOH/g
<12 mg KOH/g
ExA 76-380
134-143°C
13,000-25,000 cps at 190°C
<3 mg KOH/g
<12 mg KOH/g
Tuff 36-140
175-185°C
5,000~8,000 cps at 200°C
<10 mg KOH/g
<3 mg KOH/g
LPM 1025
145-155°C
2,500~4,500 cps at 200°C
<10 mg KOH/g
<3 mg KOH/g
More product series, please contact us.

Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt AdhesiveElectronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt AdhesiveElectronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
Product Advantage

1. Excellent bonding strength.
Spiderbond polyamide hot melt adhesive gives excellent bonding strength to different substrates.
2. Excellent high and low temperature resistance.
Spiderbond polyamide hot melt adhesive can resistant -40°C to 220°C.
3. Excellent chemical resistance, waterproof performance and insulation.
Good performance for different applications.
4. Non-toxic and environmental protection
Spiderbond polyamide hot melt adhesive's raw material comes from natural plant, non-toxic & environment protection.
5. Short open time
Save your working hours.
Electronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt AdhesiveElectronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt AdhesiveElectronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt AdhesiveElectronic Accessories Hot Melt Adhesive Insulation Polyamide Hot Melt Adhesive
FAQ
1. What is your packaging and shipping CBM?
Our regular packaging of Hot melt polyamide adhesives is Kraft paper bag or foil bag by 20 or 25kgs package.
2. How many type of Hot melt adhesives can you supply?
So far, we can supply
A. Polyamide based Hot melt adhesives.
B. Co-Polyamide Hot melt adhesives.
C. Co-Polyester hot melt adhesives.
D. Hot melt adhesive powder
E. Hot melt adhesive film & web.
3. How much is the sample?
Sample will be free. Please contact with us to get the sample for test.
4. Do you inspect the shipping goods?
Yes, the goods will go through pre-production sample inspection and shipping sample inspection by QC department before shipping.

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