• Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
  • Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
  • Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
  • Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
  • Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
  • Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics

Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics

CAS No.: 63428-84-2
Formula: C18h35n3o3
EINECS: 613-218-1
Bonding Function: PA Adhesive
Application: Metal Bonding, for Auto Wire Harnesses and Cables
Material: Hot Melt Glue Polyamide
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Gold Member Since 2015

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Rating: 5.0/5
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Basic Info.

Model NO.
126-160
Classification
Hot Melt
Main Agent Composition
Hot Melt Glue Polyamide
Characteristic
Hot Melt Glue Polyamide
Promoter Composition
Hot Melt Glue Polyamide
Composition
Hot Melt Glue Polyamide
Color
Light Yellow
Products Name
Bulk Sales Latest Technology Hot Melt Glue Polyami
Transport Package
25kgs Per Carton, Plastic Bag or Drum
Specification
PA granule
Trademark
OEM
Origin
China
HS Code
3506919090
Production Capacity
10

Product Description

Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for ElectronicsProduct description
Bulk sales latest technology hot melt glue polyamide PA adhesive for electronics

We are manufactures of low cost and high performance dimer acid based hot melt polyamide adhesives. We can deliver offsets to Henkel, Bostic and Arizona at prices that are $2 to $4 per lb., depending on the grade and color requirements. We can also tailor small batches of unique grades of HMPA to meet your specific requirements (minimum 2 ton order quantity) at these same competitive prices.

Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics

HMPA 126-160 is a thermoplastic hot melt polyamide resin based on dimer acids. It has high heat resistance, fast set (low open time), moderate flexibility, and excellent chemical and grease resistance. Applications for this adhesive are for packaging, converting and bonding pre-heated metals.
Property Detail or Method Specification
Softening Point
(R+B): 
°C Ring and Ball ASTM E 28 158-168
Viscosity cps/mPa·s at 190°C LVT Brookfield ASTM D 3236 6000-10,000 cps
Color 40% in n-Butanol, Gardner 8 Maximum
    Typical Values
Acid Value mg KOH/g 4-12
Amine Value mg KOH/g 0-2.0
Specific Gravity At 25°C 0.97
Flash Point °C, COC, ASTM D 6450 271

Packing & Shipping
Packaging: in double layer craft paper or woven compound bag
Details: 25kg/bag, 25kg/drum,1mt/bag, 15mt without pallet or 12mts/20'fcl with pallet
Delivery Detail: 15-25 days after receiving advanced T/T Payment
Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
Our services
1. Samples send to you freely
2. Delivery on time, quality according to customer request completely
3. OEM, ODM is welcome
4. Support small wholesale, retails. Any inquires will be replied within 24 hour

Company information
I-Sourcing one of hot melt polyamide leading producer in China, established in 2007, specializing in development, production and selling of hot-melt polyamide adhesives. It has been widely used in automotives, air filters, book bonding, baby diapers, textile interlining, fabric lamination, textile heat transfer printing, clothing accessories and shoes.
After more than 7 years effort and development, I-Sourcing has established advanced production lines, advanced underwater pelletizing processing. The automatic control of equipments and the continuous line production ensure the high quality and stability of our products.
Bulk Sales Latest Technology Hot Melt Glue Polyamide PA Adhesive for Electronics
FAQ

What are hot melt adhesives?
Hot melt adhesives are solid adhesives at room temperature, contain absolutely no water and solvents, and are mainly composed of thermoplastic resin. Generally speaking, hot melt coaters, known as applicators, are used to melt hot melt adhesives. Guns are used to apply these adhesives in their liquid state to the adherend, which is then crimped, cooled, and adhered. The time required to complete the adhering process is only the time required to cool and solidify the adhesive, which makes it possible to adhere objects to each other in a few seconds to a few minutes.
 
What can you tell me about the open time and setting time?
Hot melt adhesives melt under high temperatures. You have to apply these adhesives to an object and adhere another object to it before these adhesives cool and lose their adhesive properties. The open time is the period of time from when the adhesive is applied to the adherend to when the adhesive cools to the point that it loses its adhesive properties. The open time is normally a length of time from a few seconds to a few minutes and is determined on the basis of the usage conditions, ambient environment, and hot melt adhesive mixture.  The setting time is the period of time until the hot melt adhesive applied to the adherend cools, solidifies, and exhibits its initial adhesive strength.

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