• Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
  • Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
  • Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
  • Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
  • Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
  • Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive

Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive

Bonding Function: Low Temperature Resistance
Morphology: Particle
Application: Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing
Material: Polyimide
Classification: Hot Melt
Main Agent Composition: Polyurethane Elastomer
Samples:
US$ 0/grams 1 grams(Min.Order)
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Basic Info.

Model NO.
Flex+ 5052
Characteristic
Weatherability
Promoter Composition
Solvent
Composition
Organic Material
Color
Amber Color
Production Name
Hot Melt Polyamide Adhesive
Softening Point
120-130
Viscosity
2000-3200
Acid Value
8.0
Amine Value
0.8
Specific Gravity
0.97
Flash Point
271
Shipping Classification
Non-Hazardous
Transport Package
Bags
Specification
25KGS / BAG
Trademark
iSuo Chem or OEM
Origin
China
HS Code
350691
Production Capacity
2000 Tons/Year

Product Description


Low Temperature Resistance Solvent Hot Melt Polyamide AdhesiveLow Temperature Resistance Solvent Hot Melt Polyamide AdhesiveLow Temperature Resistance Solvent Hot Melt Polyamide AdhesiveLow Temperature Resistance Solvent Hot Melt Polyamide Adhesive

As Flex+ 5052 hot melt polyamide adhesive, its features include a medium softening point, long open time, low temperature
flexibility and low viscosity. 
Flex+ 5052 hot melt polyamide adhesive is recommended for multipurpose assembly, woodworking, packaging and converting
applications. It is 100% solid and soluble in organic solvents.

 

SPECIFICATION

 
Specifications Property Detail or Method Specification
Softening Point: °C Ring and Ball ASTM E 28 120-130°C
Viscosity cps/mPa·s at 190°C LVT Brookfield ASTM D 3236 2,000-3,200 cps
Color 40% ,Gardner 8 Maximum
Typical Values
Acid Value mg KOH/g 8.0
Amine Value mg KOH/g 0.8
Specific Gravity At 25°C 0.97
Flash Point °C, COC, ASTM D 6450 271
Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive
 
APPLICATION
Hot melt adhesive Flex+ 5052 can be used in Multi-components assembly, Woodworking, and Packaging
Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive


PACKAGING
Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive

Storage: Store at room temperature in a dry area.

Shipping Classification: Non-hazardous.

Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive

Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive Low Temperature Resistance Solvent Hot Melt Polyamide Adhesive

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