Customization: | Available |
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Bonding Function: | Low Temperature Resistance |
Morphology: | Particle |
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As Flex+ 5052 hot melt polyamide adhesive, its features include a medium softening point, long open time, low temperature
flexibility and low viscosity.
Flex+ 5052 hot melt polyamide adhesive is recommended for multipurpose assembly, woodworking, packaging and converting
applications. It is 100% solid and soluble in organic solvents.
SPECIFICATION
Specifications Property | Detail or Method | Specification |
Softening Point: | °C Ring and Ball ASTM E 28 | 120-130°C |
Viscosity | cps/mPa·s at 190°C LVT Brookfield ASTM D 3236 | 2,000-3,200 cps |
Color | 40% ,Gardner | 8 Maximum |
Typical Values | ||
Acid Value | mg KOH/g | 8.0 |
Amine Value | mg KOH/g | 0.8 |
Specific Gravity | At 25°C | 0.97 |
Flash Point | °C, COC, ASTM D 6450 | 271 |
Shipping Classification: Non-hazardous.